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Senior Scientist- Fan out wafer level packaging / Heterogeneous Integration Technologies (f / m / d)

Silicon Austria Labs (SAL)Graz, Austria

Vor 30+ Tagen

Stellenbeschreibung

YOUR FUTURE RESPONSIBILITIES

Coordination of infrastructure ramp up for FOWLP line at Silicon Austria labs
Development and optimization of FOWLP processes for both chip-first and chip-last approaches, including die placement, wafer-level molding, processing of RDL & TMV.
Designing fan-out package layouts, considering electrical performance, thermal dissipation, and reliability.
Concept development, DOE planning, and characterization in an interdisciplinary team
Development of FOWLP SIP for Power Electronics, MEMS and RF devices
Contributing to different industrial projects
Data analysis
Technical reporting and scientific dissemination
Project management

YOUR PROFILE

M.Sc. + 7 years of relevant working experience (or higher) in Physics, microsystems fabrication, power electronics and electronics engineering or relevant industrial experience

In-depth knowledge and hands-on experience with FOWLP processes, materials, and equipment.

Familiarity with packaging design tools, such as Cadence or Mentor Graphics for layout and design rule checks

Cleanroom and microfabrication experience

Project management experience as well as research funding proposals

Fluent oral and written communication skills in English, knowledge of German is a plus

IMPORTANT FACTS ABOUT SAL

Start of your employment as soon as possible.

State-of-the-art laboratory facilities and instruments.

Internal and external training opportunities for further technical and personal development.

Flexible working time and possibilities for Home Office .

4 / day food allowance in restaurants / € 2 / day in supermarkets.

Family & kids friendly.

Free coffee / milk / tea.